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plaCMOS project is developing powerful integration technology that will allow an eight-fold increase in the speed of optical transceivers used in datacenters. plaCMOS relies on small-proximity wafer scale integration of novel ferroelectric-based plasmonic-photonic modulators, silicon germanium photodetectors and BiCMOS electronics combined in a super-fast, micrometer-scale optical engine capable of transmitting and receiving data at world’s fastest speed of 200 Gbit/s per optical channel.
The project is performing multidisciplinary research extending from novel materials to plasmonic-photonic devices, high-speed electronics and transceiver modules in order to deliver a fully functional solution complying with industry standards while surpassing performance expectations. Driven by user needs, plaCMOS aims to bridge innovative research with near-market exploitation, paving the way for next generation Tbit/s transceivers in monolithic chips.
plaCMOS is a research project on photonic integration, supported by the Horizon2020 Framework Programme for Research and Innovation of the European Commission. The three-year project started officially on December 1, 2017 and brings together seven leading European companies, research centers and universities.
plaCMOS kick-off meeting
The kick-off meeting of plaCMOS took place on 9-10 January 2018 in Roskilde, Denmark. The meeting was hosted and organized by Mellanox at its Danish site.